EP3805415

METAL PLATE FOR MANUFACTURING DEPOSITION MASK, METHOD FOR MANUFACTURING METAL PLATE, DEPOSITION MASK AND METHOD FOR MANUFACTURING DEPOSITION MASK

granted
JurisdiktionEP
Anmeldedatum08. Okt. 2020
Veröffentlichungsdatum30. Nov. 2022
Erteilungsdatum30. Nov. 2022
Ablaufdatum08. Okt. 2040
Veröffentlichungsnr.EP3805415
Anmeldenr.EP20200827
UPC-Verfahren1

Zusammenfassung

A method for manufacturing a metal plate, the metal plate including a first surface and a second surface positioned on the opposite side of the first surface, may include a step of rolling a base metal having an iron alloy containing nickel to produce the metal plate. The metal plate may include particles containing as a main component an element other than iron and nickel. In a sample including the first surface and the second surface of the metal plate, the following conditions (1) and (2) regarding the particles may be satisfied.(1) The number of the particles having an equivalent circle diameter of 1 µm or more is 50 or more and 3000 or less per 1 mm<sup>3</sup> in the sample.(2) The number of the particles having an equivalent circle diameter of 3 µm or more is 50 or less per 1 mm<sup>3</sup> in the sample.

Anmelder

DAINIPPON PRINTING CO LTD [JP]

Erfinder

OKA HIROKI [JP]IKENAGA CHIKAO [JP]MATSUURA SACHIYO [JP]ENDO SHOGO [JP]HATSUTA CHIAKI [JP]NARITA ASAKO [JP]

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Klassifikation

IPC-Klassen
C21C 7/10C21D 8/02C22B 9/00C22B 9/04C22B 9/05C22B 9/20C22C 19/03C22C 38/40C23C 14/02C23C 14/04C23C 14/12C23C 14/24C23C 14/58C23C 16/04H01J 29/07H01J 9/14H01J 9/42H10K 99/00
CPC-Klassen
B21B 1/38C22B 9/006C22B 9/04C22B 9/05C22B 9/20C22C 19/03C22C 38/08C23C 14/042C23C 14/12C23C 14/24C23F 1/02H10K 71/00H10K 71/166
AI: ManufacturingSemiconductorsChemistry
warum

Dainippon OLED deposition mask — H01J29 + H10K + C2x. The product is a precision-rolled metal plate used in OLED manufacturing — Manufacturing primary; Semiconductors secondary (target application is display panels); Chemistry secondary (alloy/inclusions). Drift: rule had Chemistry only.

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